SAFI-Tech, Inc.: Supercooled Soldering for Next-Generation Electronic Devices
No-Heat SAC305: enabling the future of electronics
The electronics manufacturing world has long desired a low heat processing solution for soldering. Advanced electronics designs with lightweight flexible substrates and sensitive miniaturized components require a dramatic reduction in processing heat while still maintaining high operating temperature requirements. SAFI-Tech’s patented platform allows SAC305, the industry standard high temperature alloy, and many other alloys to be processed at temperatures as low as ambient opening the door to the future of electronics.
SAFI-Tech has created a patented platform technology that creates microparticles of liquid metal with a thin oxide shell. The liquid metal in these microcapsules can be kept in a liquid state far below the normal freezing point of metal. When the shell is dissolved or broken, the liquid in these microcapsules is released, creating metallic connections and traces as low as room temperature.
SAFI-Tech’s supercooled platform was invented by co-founders Dr. Ian Tevis and Dr. Martin Thuo at Iowa State University.
UN Sustainable Development Goals
Dr. Ian Tevis
CTO and President
Dr. Martin Thuo
Larta was instrumental in helping us to navigate the SBIR application process. With their help, we were able to secure SBIR awards that directly funded our product development.
Dr. Ian Tevis
Co-Found, CTO, and President
July 13, 2022
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SAFI-Tech New Supercooled Soldering Technology
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Safi-Tech encapsulates solders for next-generation electronics